2003
Chipsbank founded, beginning the journey of domestic chip design.
Mass production delivery
Two decades of multi-chip mass-production experience — delivering certainty to the line
Chipsbank is no newcomer to the chip industry. Since 2003, we have been rooted in the Chinese chip-design industry, with cumulative flash-controller chip sales surpassing 3.5 billion units. This deep chip-industry experience underpins the mass-production delivery of our UWB chips, and our end-to-end know-how covers design, supply chain and the production line.
Our foundation
From flash controllers to UWB — two decades of focus
Design with heart, empower the nation with chips. Integrity, innovation, collaboration and execution are the genes that keep us winning.
Values
Integrity · Innovation · Collaboration · Execution
Mission
Design with heart, empower the nation with chips
Vision
To become a star enterprise in chip design
2004
First mainland flash-controller chip taped out.
2005
Backed by Lenovo and Intel VC; monthly sales exceeded 1 million units.
2006
Named among Top 50 most investable unlisted companies.
2011
First touch-controller chip developed, expanding into human-machine interaction.
2021
UWB product line established, entering precision connectivity.
2024
World's first UWB & BLE chip launched, redefining the single-chip paradigm.
Mass-production track record
Mass production is not new to us
From early flash-controller chips to UWB chips, large-scale delivery is baked into our organizational capability.
In 2005, flash-controller chip sales surpassed one million units per month, and cumulatively over 3.5 billion units, giving Chipsbank scale delivery and ramp-up capability early on.
Xiaomi, TCL, Hisense and Huawei have brought our UWB pointing-remote solution into design-in; CVTE is already in mass production.
From reference design to line qualification in as fast as three months, with our proprietary single-point calibration bringing single-line efficiency to 300+ units per hour.
A repeatable quality-consistency system spanning antenna design, structural matching, calibration and defect screening.
Capability pillars
Five pillars behind every delivery
Team, algorithms, antennas, mechanics and mass-production experience form the complete delivery capability our customers rely on.
Team from industry leaders
Core developers come from HiSilicon, Skyworks and OKI, with deep technical and product expertise and systematic control of production details.
Free fusion algorithm
We provide the IMU + UWB loosely-coupled fusion algorithm at no cost, delivering a silky pointing experience even on low-cost MCUs.
Antenna IP portfolio
Holding patents on multiple directional and omnidirectional antenna designs already applied across a dozen product lines. We have particularly rich experience with PDOA angle-of-arrival solutions and can quickly resolve antenna-to-structure matching issues.
Mechanical know-how
Extensive experimental experience tells us how to design the transmit and receive ends of UWB so as to ensure consistency and accuracy of UWB data.
Line optimization & QC
We help customers optimize lines, screen defects and guarantee data consistency — minimizing mass-production uncertainty.
Supply-chain assurance
Supply-chain and quality management that remove delivery uncertainty
Chip mass production is not a single-point skill; it requires command of the entire supply chain. Chipsbank uses mature supplier systems and quality processes to keep delivery risks out.
- Strategic wafer and packaging coordination with long-term stable partnerships with mainstream foundries and OSATs.
- Dual-source qualification for critical materials to avoid single-supplier disruption.
- Three-stage quality gates: incoming inspection, in-process control and outgoing test.
- Full lot traceability from wafer to module through a complete data chain.
- Advance capacity-ramp planning with shared forecasts to lock in capacity early.
- Failure analysis and rapid response to shorten the mass-production issue close-loop.
Delivery flow
A repeatable mass-production delivery flow
From design-in to stable mass production, every step is standardized so customers take fewer detours.
01 Reference design delivery
Provide production-proven circuit reference designs to quickly establish the product baseline.
02 Design review & test
Join customer schematic, PCB and mechanics reviews; deliver antenna and structural guidance and support testing.
03 Antenna/mechanics tuning
Use in-house simulation servers and anechoic chamber to optimize antennas and match whole-device mechanics.
04 Calibration deployment
Roll out single-point calibration on the line for high throughput, low defect rates and easy replication across sites.
05 Line optimization & screening
Help customers build line test stations, data dashboards and defect-screening standards.
06 Volume ramp & supply
Ramp capacity, stabilize quality and move into long-term supply with continuous supply-chain and technical support.
Bring your UWB product reliably to the line
From reference designs and algorithm licensing to supply-chain and line optimization, Chipsbank delivers one-stop mass-production services.